Burnt Clay Brick Aggregate for Internal Curing of Concrete under Adverse Curing Conditions
Solid-state circuits; ISSCC 2012; blick auf die Chips von morgen
Analysis of chip formation mechanism in turning of AA 7075/SiCp MMCs
Autoregistration of high-resolution satellite imagery using LIDAR intensity data
Burnt Clay Brick Aggregate for Internal Curing of Concrete under Adverse Curing Conditions
Embedded Thermal Control for Spacecraft Subsystems Miniaturization
Automatic Character Detection System for IC Test Handler Based on Active Learning SVM
Metal Cutting - Chip Formation; Cutting in Microstructure
On the design of hybrid DRAM/SRAM memory schemes for fast packet buffers
NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Overview
Microscope-on-Chip Using Micro-Channel and Solid State Image Sensors